[1] 崔岩.碳化硅颗粒增强铝基复合材料的航空航天应用[J].材料工程, 2002(6):3-6.

CUI Y. Aerospace applications of silicon carbide particulate reinforced aluminium matrix composites[J]. Journal of Materials Engineering, 2002(6):3-6.(in Chinese)
[2] 曾婧, 彭超群, 王日初, 等.电子封装用金属基复合材料的研究进展[J].中国有色金属学报, 2015, 25(12):3255-3270.

ZENG J, PENG CH Q, WANG R CH, et al.. Research and development of metal matrix composites for electronic packaging[J]. The Chinese Journal of Nonferrous Metals, 2015, 25(12):3255-3270.(in Chinese)
[3] 吴米贵, 刘君武, 蒋会宾.无压浸渗制备SiCp/Al复合材料的力学性能研究[J].粉末冶金工业, 2014, 24(2):24-28.

WU M G, LIU J W, JIANG H B. Study on mechanical properties of SiCp/Al composites prepared by pressureless infiltration[J]. Powder Metallurgy Industry, 2014, 24(2):24-28.(in Chinese)
[4] 韩桂泉, 胡喜兰, 李京伟.无压浸渗制备结构/功能一体化铝基复合材料的性能及应用[J].航空制造技术, 2006(1):95-97, 100.

HAN G Q, HU X L, LI J W. Property and application of the structure/function integration aluminum matrix composite prepared by pressureless infiltration[J]. Aeronautical Manufacturing Technology, 2006(1):95-97, 100.(in Chinese)
[5] 章令晖, 陈萍.复合材料在空间遥感器中的应用进展及关键问题[J].航空学报, 2015, 36(5):1385-1400.

ZHANG L H, CHEN P. Application progress of composites in space remote sensor and its key problems[J]. Acta Aeronautica et Astronautica Sinica, 2015, 36(5):1385-1400.(in Chinese)
[6] 李佳双, 屈敏, 崔岩, 等.Si、Mg含量对Al-Mg-Si合金显微组织及显微硬度的影响[J].金属热处理, 2016, 41(12):69-74.

LI J SH, QU M, CUI Y, et al.. Effect of Si, Mg content on microstructure and microhardness of Al-Mg-Si alloy[J]. Heat Treatment of Metals, 2016, 41(12):69-74.(in Chinese)
[7] 崔葵馨, 常兴华, 李希鹏, 等.高体积分数铝碳化硅复合材料研究进展[J].材料导报, 2012, 26(S2):401-405.

CUI K X, CHANG X H, LI X P, et al.. Advances in research on high volume fraction aluminum silicon carbide composites[J]. Materials Review, 2012, 26(S2):401-405.(in Chinese)
[8] 刘冀念, 董蓉桦, 刘炎, 等.高体积分数SiCp/7075Al复合材料的时效析出行为[J].材料科学与工程学报, 2016, 34(3):357-361.

LIU J N, DONG R H, LIN Y, et al.. Aging behavior of high volume fraction SiCp/7075Al composites[J]. Journal of Materials Science and Engineering, 2016, 34(3):357-361.(in Chinese)
[9] 金鹏, 刘越, 李曙, 等.颗粒增强铝基复合材料在航空航天领域的应用[J].材料导报, 2009, 23(11):24-27, 39.

JIN P, LIU Y, LI SH, et al.. Aerospace applications of particulate reinforced aluminum matrix composites[J]. Materials Review, 2009, 23(11):24-27, 39.(in Chinese)
[10] 钟鼓, 吴树森, 万里.高SiCp或高Si含量电子封装材料研究进展[J].材料导报, 2008, 22(2):13-17.

ZHONG G, WU SH S, WAN L. Research development of electronic packaging materials with high SiCp or Si content[J]. Materials Review, 2008, 22(2):13-17.(in Chinese)
[11] 张晓辉, 王强.电子封装用金属基复合材料的研究现状[J].微纳电子技术, 2018, 55(1):18-25, 44.

ZHANG X H, WANG Q. Research state of metal-matrix composites for electronic packaging[J]. Micronanoelectronic Technology, 2018, 55(1):18-25, 44.(in Chinese)
[12] MAO X ZH, HONG Y, WANG B H, et al.. Fabrication, microstructures and properties of 50 vol.-% SiCp/6061Al composites via a pressureless sintering technique[J]. Powder Metallurgy, 2017, 61(1):1-9.
[13] 王治国.纳米SiC增强铝基复合材料的粉末冶金法制备及其力学性能[D].长春: 吉林大学, 2016.

WANG ZH G. Fabrication and mechanical properties of nano-SiC reinforced aluminum matrix composites by powder metallurgy method[D]. Changchun: Jilin University, 2016.(in Chinese)
[14] 崔葵馨.高体积分数铝碳化硅复合材料中试工艺研究[D].长沙: 中南大学, 2013.

CUI K X. Pilot-scale study on high volume fraction AlSiC composite[D]. Changsha: Central South University, 2013.(in Chinese)
[15] 崔岩, 郭顺, 赵会友.高体份SiCp/Al复合材料型芯法无压浸渗近净成形制备技术[J].航空材料学报, 2010, 30(6):51-56.

CUI Y, GUO SH, ZHAO H Y. Near net-shape forming technique with mold core of high volume fraction SiCp/Al composite in pressureless infiltration process[J]. Journal of Aeronautical Materials, 2010, 30(6):51-56.(in Chinese)
[16] 崔岩.一种高体份颗粒增强金属基复合材料的近净形制备方法: 中国, CN102009160A[P].2011-04-13.

CUI Y. A net-shape preparation method for high volume particulate reinforced metal matrix composites: CN, CN102009160A[P]. 2011-04-13.(in Chinese)
[17] 崔岩, 张洪立.一种高体份颗粒增强金属基复合材料管材的制造方法: 中国, CN101423904A[P].2009-05-06.

CUI Y, ZHANG H L. Manufacturing method of high volume particle reinforced metal matrix composite pipe: CN, CN101423904A[P].2009-05-06.(in Chinese)
[18] FANG W, HE X B, ZHANG R J, et al.. Evolution of stresses in metal injection molding parts during sintering[J]. Transactions of Nonferrous Metals Society of China, 2015, 25(2):552-558.
[19] 熊德赣, 程辉, 刘希从, 等.AlSiC电子封装材料及构件研究进展[J].材料导报, 2006, 20(3):111-115.

XIONG D G, CHENG H, LIU X C, et al.. Advances in research on aluminum silicon carbide electronic packaging composites and components[J]. Materials Review, 2006, 20(3):111-115.(in Chinese)
[20] OCCHIONERO M A, HAY R A, ADAMS R W, et al.. Aluminum silicon carbide(AlSiC) for cost-effective thermal management and functional microelectronic packaging design solutions[EB/OL]. http://pdfs.semanticscholar.org/c900/26f270a8d8278db3fa1bfc68875683addedb.pdf.
[21] 张强, 姜龙涛, 武高辉.无压浸渗法制备氧化态SiC颗粒增强铝基复合材料[J].无机材料学报, 2012, 27(4):353-357.

ZHANG Q, JIANG L T, WU G H. Fabrication of oxidized SiC particles reinforced aluminum matrix composite by pressureless infiltration technique[J]. Journal of Inorganic Materials, 2012, 27(4):353-357.(in Chinese)
[22] 梁建芳.无压浸渗制备Al/SiCp电子封装材料的结构与性能[D].西安: 西北工业大学, 2006.

LIANG J F. The structure and properties of Al/SiCp composites preparated by pressureless infiltration for electronic packaging[D]. Xi'an: Northwestern Polytechnical University, 2006.(in Chinese)
[23] 刘媛媛.无压浸渗法制备β-SiCp/Al电子封装材料工艺与性能研究[D].西安: 西安科技大学, 2008.

LIU Y Y. Fabrication and properties of β-SiCp/Al electronic packaging material by pressureless infiltration[D]. Xi'an: Xi'an University of Science and Technology, 2008.(in Chinese)
[24] 熊德赣, 杨盛良, 白书欣, 等.带金属密封环的AlSiC管壳制备与性能[J].电子与封装, 2008, 8(3):14-17, 21.

XIONG D G, YANG SH L, BAI SH X, et al.. Fabrication and property of aluminum silicon carbide packaging housing with metal seal ring[J]. Electronics & Packaging, 2008, 8(3):14-17, 21.(in Chinese)
[25] 王小锋, 王日初, 彭超群, 等.凝胶注模成型技术的研究与进展[J].中国有色金属学报, 2010, 20(3):496-509.

WANG X F, WANG R CH, PENG CH Q, et al.. Research and development of gelcasting[J]. The Chinese Journal of Nonferrous Metals, 2010, 20(3):496-509.(in Chinese)
[26] 赵文兴, 张舸, 赵汝成, 等.轻型碳化硅质反射镜坯体的制造工艺[J].光学 精密工程, 2011, 19(11):2609-2617.

ZHAO W X, ZHANG G, ZHAO R CH, et al.. Fabrication of silicon carbide lightweight mirror blank[J]. Opt. Precision Eng., 2011, 19(11):2609-2617.(in Chinese)
[27] 武高辉.金属基复合材料设计引论[M].北京:科学出版社, 2016:42-57.

WU G H. Introduction of Metal Matrix Composite Design[M]. Beijing:Science Press, 2016:42-57.(in Chinese)
[28] 修子扬, 张强, 王子鸣, 等.电子封装用SiCp/6063复合材料的制备与性能研究[J].精密成形工程, 2018, 10(1):91-96.

XIU Z Y, ZHANG Q, WANG Z M, et al.. Preparation and properties of SiCp/6063 composites for electronic packaging[J]. Journal of Netshape Forming Engineering, 2018, 10(1):91-96.(in Chinese)
[29] 谢斌, 王晓刚, 华小虎, 等.底部真空负压浸渗工艺制备β-SiCp/Al电子封装材料[J].铸造, 2013, 62(10):953-957.

XIE B, WANG X G, HUA X H, et al.. β-SiCp/Al composites for electronic packaging prepared by the process of bottom-vacuum negative pressure infiltration[J]. Foundry, 2013, 62(10):953-957.(in Chinese)
[30] 崔岩, 李丽富, 李景林, 等.制备空间光机结构件的高体份SiC/Al复合材料[J].光学 精密工程, 2007, 5(8):1175-1180.

CUI Y, LI L F, LI J L, et al.. High volume fraction SiC/Al composites for space-based optomechanical structures[J]. Opt. Precision Eng., 2007, 5(8):1175-1180.(in Chinese)
[31] AGHAJANIAN M K, ROCAZELLA M A, BURKE J T, et al.. The fabrication of metal matrix composites by a pressureless infiltration technique[J]. Journal of Materials Science, 1991, 26(2):447-454.
[32] CUI Y, GAN S M, LIU F B, et al.. Analysis of porosity in high volume fraction SiCp/Al composites fabricated by pressureless infiltration[J]. Materials Research Innovations, 2015, 19(S9):S9-116-S9-122.
[33] XIE B, WANG X G. Thermo-physical properties and reaction process of SiCp/Al-7Si-5Mg aluminum matrix composites fabricated by pressureless infiltration[J]. Rare Metal Materials and Engineering, 2015, 44(5):1057-1061.
[34] KARANDIKAR P G, AGHAJANIAN M K, AGRAWAL D, et al.. Microwave assisted (Mass) processing of metal-ceramic and reaction-bonded composites[M]. Hoboken, NJ:Wiley, 2006:435-446.
[35] 王武杰, 洪雨, 吴玉程.SiC粒径比及体积比对SiCp/Al-5Si-2.5Mg复合材料组织及性能影响[J].材料热处理学报, 2018, 39(7):7-14.

WANG W J, HONG Y, WU Y CH. Effect of SiC particle size ratio and volume fraction ratio on microstructure and properties of SiCp/Al-5Si-2.5Mg composites[J]. Transactions of Materials and Heat Treatment, 2018, 39(7):7-14.(in Chinese)
[36] 顾晓峰, 张联盟, 杨梅君, 等.SiCp/Al复合材料的SPS烧结及热物理性能研究[J].无机材料学报, 2006, 21(6):1405-1410.

GU X F, ZHANG L M, YANG M J, et al.. Fabrication and thermophysical properties of SiCp/Al metal-matrix composites by SPS[J]. Journal of Inorganic Materials, 2006, 21(6):1405-1410.(in Chinese)
[37] 刘兴丹, 阎峰云, 赵红娟, 等.烧结温度对SiCp/Al复合材料组织与性能的影响[J].粉末冶金材料科学与工程, 2017, 22(1):20-25.

LIU X D, YAN F Y, ZHAO H J, et al.. Effect of sintering temperatrue on microstructure and properties of SiCp/Al composites[J]. Materials Science and Engineering of Powder Metallurgy, 2017, 22(1):20-25.(in Chinese)
[38] 武高辉, 姜龙涛, 陈国钦, 等.仪表级复合材料在惯性仪表中的应用进展[J].导航定位与授时, 2014, 1(1):63-68.

WU G H, JIANG L T, CHEN G Q, et al.. Application progress of instrument grade Al matrix composites in inertial instruments[J]. Navigation Positioning & Timing, 2014, 1(1):63-68.(in Chinese)
[39] MOHN W R, VUKOBRATOVICH D. Recent applications of metal matrix composites in precision instruments and optical systems[J]. Journal of Materials Engineering, 1988, 10(3):225-235.
[40] 聂俊辉, 樊建中, 魏少华, 等.航空用粉末冶金颗粒增强铝基复合材料研制及应用[J].航空制造技术, 2017(16):26-36.

NIE J H, FAN J ZH, WEI SH H, et al.. Research and application of powder metallurgy particle reinforced aluminum matrix composite used in naviation[J]. Aeronautical Manufacturing Technology, 2017(16):26-36.(in Chinese)
[41] 许小静, 张绪虎, 王亮, 等.中低体积分数SiCp/Al在航空航天领域的应用与发展[J].宇航材料工艺, 2011, 41(3):5-7.

XU X J, ZHANG X H, WANG L, et al.. Development and application of medium/low volume-fraction SiCp/Al composites in aerospace field[J]. Aerospace Materials & Technology, 2011, 41(3):5-7.(in Chinese)
[42] 齐光, 王书新, 李景林.空间遥感器高体分SiC/Al复合材料反射镜组件设计[J].中国光学, 2015, 8(1):99-106.

QI G, WANG SH X, LI J L. Design of high volume fraction SiC/Al composite mirror in space remote sensor[J]. Chinese Optics, 2015, 8(1):99-106.(in Chinese)
[43] 田富湘, 何欣.基于高体分SiCp/Al材料的空间相机主支撑结构研制[J].红外, 2015, 36(11):36-40.

TIAN F X, HE X. Development of welded space camera supporting structure based on high volume SiCp/Al composites[J]. Infrared, 2015, 36(11):36-40.(in Chinese)
[44] MOHN W R, VUKOBRATOVICH D. Engineered metal matrix composites for precision optical systems[J]. SAMPE Journal, 1988, 24(1):26-35.
[45] GEIGER A L, SR E U. Production of metal matrix composite mirrors for tank fire control systems[J]. Proceedings of SPIE, 1992, 1690:232-243.
[46] JIANG X X, LAURIN D G, LEVESQUE D, et al.. Design and fabrication of a lightweight laser scanning mirror from metal-matrix composites[J]. Proceedings of SPIE, 2001, 4444:1-8.
[47] 程志峰, 张葆, 崔岩, 等.高体份SiC/Al复合材料在无人机载光电稳定平台中的应用[J].光学 精密工程, 2009, 17(11):2820-2827.

CHENG ZH F, ZHANG B, CUI Y, et al.. Application of high volume fraction SiC/Al composites to unmanned airborne photoelectric platforms[J]. Opt. Precision Eng., 2009, 17(11):2820-2827.(in Chinese)
[48] 李畅, 何欣, 刘强.高体份SiC/Al复合材料空间相机框架的拓扑优化设计[J].红外与激光工程, 2014, 43(8):2526-2531.

LI CH, HE X, LIU Q. Design and topology optimization of space camera frame fabricated by high volume fraction SiC/Al composite material[J]. Infrared and Laser Engineering, 2014, 43(8):2526-2531.(in Chinese)
[49] LOU H S, QU S G, WANG B, et al, . Glass coating on SiCp/Al composite mirror for ultra-smooth surface[J]. International Journal of Advanced Manufacturing Technology, 2017, 88(2):1745-1753.
[50] ZWEBEN C. Metal-matrix composites for electronic packaging[J]. JOM, 1992, 44(7):15-23.
[51] RAWAL S P. Metal-matrix composites for space applications[J]. JOM, 2001, 53(4):14-17.
[52] OCCHIONERO M A, HAY R A, ADAMS R W, et al. Aluminum silicon carbide(AlSiC) thermal management packaging for high density packaging applications[C]. Proceedings of SPIE-The International Society for Optical Engineering, 1999.
[53] 谢大鹏, 崔葵馨, 金胜明.IGBT用AlSiC复合材料的制备研究[J].佛山陶瓷, 2018, 28(2):14-18.

XIE D P, CUI K X, JIN SH M. Preparation of AlSiC composite for IGBT[J]. Foshan Ceramics, 2018, 28(2):14-18.(in Chinese)
[54] 何新波, 任淑彬, 曲选辉, 等.电子封装用高导热金属基复合材料的研究[J].真空电子技术, 2010(4):1-4.

HE X B, REN SH B, QU X H, et al.. Preparation of high thermal conductivity metal matrix composites for electronic packaging[J]. Vacuum Electronics, 2010(4):1-4.(in Chinese)
[55] 吴金方, 刘君武, 丁锋, 等.AlSiC电子封装材料的凝胶注模法制备[J].合肥工业大学学报(自然科学版), 2011, 34(3):336-340.

WU J F, LIU J W, DING F, et al.. Preparation of AlSiC electronic package materials by gel-casting[J]. Journal of Hefei University of Technology(Natural Science), 2011, 34(3):336-340.(in Chinese)
[56] 熊德赣, 刘希从, 堵永国, 等.小批量铝碳化硅T/R组件封装外壳的研制[J].电子与封装, 2004, 4(4):29-32.

XIONG D G, LIU X C, DU Y G, et al.. The research of a small amount AlSiC packaging housing of T/R module[J]. Electronics & Packaging, 2004, 4(4):29-32.(in Chinese)