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激光微熔覆技术的发展及应用

蔡志祥 曾晓雁

蔡志祥, 曾晓雁. 激光微熔覆技术的发展及应用[J]. 中国光学(中英文), 2010, 3(5): 405-414.
引用本文: 蔡志祥, 曾晓雁. 激光微熔覆技术的发展及应用[J]. 中国光学(中英文), 2010, 3(5): 405-414.
CAI Zhi-xiang, ZENG Xiao-yan. Development and applications of laser micro cladding[J]. Chinese Optics, 2010, 3(5): 405-414.
Citation: CAI Zhi-xiang, ZENG Xiao-yan. Development and applications of laser micro cladding[J]. Chinese Optics, 2010, 3(5): 405-414.

激光微熔覆技术的发展及应用

基金项目: 

国家863高技术研究发展计划资助项目(No.2007AA030114)

详细信息
    作者简介:

    蔡志祥(1980—),男,江苏盐城人,讲师,主要从事激光微纳制造技术方面的研究。E-mail: caizhix@gmail.com

  • 中图分类号: TG156.99

Development and applications of laser micro cladding

  • 摘要: 基于激光的直写技术具有加工周期短、使用灵活、无需掩模、环境要求低等诸多优点,其在微电子等领域应用广泛。本文引入了一种新的激光直写技术激光微熔覆技术,介绍了该技术的工艺过程及特点,并在此基础上集成制造了激光微熔覆设备。通过激光与物质的相互作用原理,理论分析了激光微熔覆电子浆料的成型机理。最后,举例说明该技术在微电子、光电子以及传感器领域的应用,并对该技术的发展趋势进行了初步预测,认为该技术在混合集成电路基板的加工、微型传感器和加热器的制造、平面无源电子器件和分立无源电子器件的研制以及生物芯片、电子封装等领域有好的发展前景。

     

  • [1] 张立鼎.先进电子制造技术[M] .北京:国防工业出版社,2000. ZHANG D. Advanced Electron Technique of Manufacture[M]. Beijing:Defence Inductry Press,2000.(in Chinese) [2] 刘敬伟,曾晓雁 .激光直写技术的现状和展望[J]. 激光杂志 ,2001,22(6):15-18. LIU J W,ZENG X Y. Status and prospect of laser direct writing[J]. Laser J.,2001,22(6):15-18.(in Chinese) [3] HON K K B,LI L,HUTCHINGS I M. Direct writing technology-advances and developments [J]. CIRP Annals-Manufacturing Technol.,2008,57(2):601-620. [4] VENUVINOD P K,MA W Y. Rapid Prototyping:Laser-Based and Other Technologies[M]. Dordrecht:Kluwer Academic Publishers,2004. [5] DANFORTH S C,DIMOS D,PRINZ F. Materials development for direct-write technologies . In Materials Research Society Spring 2000 Meeting,Proceedings of Symposium V,San Francisco,23-27,April,2000. [6] ROHMUND F,MORJAN R E,LEDOUX G,et al.. Carbon nanotube films grown by laser-assisted chemical vapor deposition[J]. J. Vac. Sci. Technol. B,2002,20:802-804. [7] KWOK K,CHIU W K S. Growth of carbon nanotubes by open-air laser-induced chemical vapor deposition[J]. Carbon,2005,43:437-439. [8] WEE L M,LI L. Multiple-layer laser direct writing metal deposition in electrolyte solution[J]. App. Surf. Sci.,2005,247:285-293. [9] SHACHAM Y,DUBIN V,ANGYAL M. Electroless copper deposition for ULSI[J]. Thin Solid Films,1995,262:93-103. [10] CHRISEY D B,PIQUE A,GERALD J F. New approach to laser direct writing active and passive mesoscopic circuit elements[J]. Appl. Surf. Sci.,2000,154-155:593-600. [11] ZENG X Y,LI X Y,LIU J W,et al.. Direct fabrication of electric components on insulated boards by laser micro cladding electronic pastes[J]. IEEE Transactions on advanced packaging,2006,29(2):291-293. [12] LI X Y,LI H L,CHEN Y Q,et al.. Silver conductor fabrication by laser direct writing on Al2O3 substrate[J]. Appl. Phys. A,2004,79(8):1861-1863. [13] CAI Z X,LI X Y,HU Q W,et al.. Fabrication of microheater by laser micro cladding electronic paste[J]. Mater. Sci. Eng. B,2009,157(1):15-19. [14] CAI Z X,LI X Y,HU Q W,et al.. Laser sintering of thick-film PTC thermistor paste deposited by micro-pen direct writing[J]. Microelectronics Eng.,2009,86(1):10-15. [15] CAI Z X,LI X Y,ZENG X Y. Direct fabrication of SnO2-based thick film gas sensor using micropen direct writing and laser micro cladding[J]. Sensor Actuator B Chem.,2009,137(1):340-344. [16] LI X Y,LI H L,LIU J W,et al.. Conductive line preparation on resin surfaces by laser micro-cladding conductive pastes[J]. Appl. Surface Sci.,2004,233(1-4):51-57. [17] LI X Y,ZENG X Y. Parameters and quality control by pulsed Nd:YAG laser cutting . ICALEO 2003,the 22nd International Congress on Applications of Lasers & Electro-optics,Jacksonville,Florida,13-16 Oct,2003. [18] LI H L,ZENG X Y,LI H F,et al.. Research on film thickness of micro-fine conductive line from the laser cladding and flexibly direct writing technique[J]. Chinese Opt. Lett.,2004,2(11):654-657. [19] 李慧玲,曾晓雁,李祥友. 玻璃基板上激光微细熔覆直写电阻技术的研究[J]. 中国激光 ,2005,32(2):281-286. LI H L,ZENG X Y,LI X Y. Direct fabrication of resistor on glass board by laser micro-fine cladding[J]. Chinese J. Lasers,2005,32(2):281-286.(in Chinese) [20] 李慧玲,曾晓雁,李祥友,等. 激光微细熔覆柔性直写厚膜导带组织性能的研究[J]. 中国激光 ,2005,32(7):1001-1005. LI H L,ZENG X Y,LI X Y,et al.. Research on structure property of thick-film conductive lines fabricated by laser micro-fine cladding and flexibly direct writing[J]. Chinese J. Lasers,2005,32(7):1001-1005.(in Chinese) [21] 李慧玲,曾晓雁. 搭接量对激光微细熔覆柔性直写厚膜电阻组织性能的影响[J]. 中国激光 ,2005,32(11):1554-1560. LI H L,ZENG X Y. Effect of overlapped spaces on structure property of thick-film resistors flexibly and directly fabricated by laser micro-cladding[J]. Chinese J. Lasers,2005,32(11):1554-1560.(in Chinese) [22] CAO Y,LI X Y,ZENG X Y. Frequency characteristics of the MIM thick film capacitors fabricated by laser micro-cladding electronic pastes[J]. Mat. Sci. Eng. B-SOLID,2008,150(3):157-162. [23] 王少飞,曹宇,王小宝,等. 激光微细熔覆快速制造微加热器阵列[J]. 中国激光 ,2007,34(11):1567-1570. WANG SH F,CAO Y,WANG X B,et al.. Microheater array fabrication by laser micro-cladding method[J]. Chinese J. Lasers,2007,34(11):1567-1570.(in Chinese) [24] 李祥友,蔡志祥,曹宇,等. 基于微细笔和激光微熔覆的设备研制[J]. 应用激光 ,2007,27(2):81-84. LI X Y,CAI ZH X,CAI Y,et al.. Equipment manufacture based on laser micro-cladding & micropen[J]. Appl. Laser,2007,27(2):81-84.(in Chinese) [25] MEUNIER M,IZQUIERDO R,DESJARDINS P,et al.. Laser direct writing of tungsten from WF6[J]. Thin Solid Films,1992,218(1-2):137-143. [26] MOILANEN H,REMES J,LEPPAVUORI S,et al.. Low resistivity LCVD direct write Cu conductor lines for IC customization[J]. Phys. Scipta T,1997,T69:237-241. [27] TERRILL R E,CHURCH K H,MOON M. Laser chemical vapor deposition for microelectronics production . IEEE Aerospace Applications Conference Proceedings,1998,1:377-382. [28] POPOV C,IVANOV B,SHANOV V. Laser-induced chemical vapor deposition of aluminum from trimethylamine alane[J]. J. Appl. Phys.,1994,75(7):3687-3689. [29] LEHMANN O,STUKE M. Laser-driven movement of three-dimensional microstructures generated by laser rapid prototyping[J]. Science,1995,270(5242):1644-1646. [30] LEHMANN O,STUKE M. Three-dimensional laser direct writing of electrically conducting and isolating microstructures[J]. Mater. Lett.,1994,21(2):131-136. [31] Von GUTFELD R J,TYNAN E E,MELCHER R L,et al.. Laser enhanced electroplating and maskless pattern generation[J]. Appl. Phys. Lett.,1979,35(9):651-653. [32] KRIPESH V,GUST W,BHATNAGAR S K,et al. Effect of Nd:YAG laser micromachining on gold conductor printed over ceramic substrates[J]. Mater. Lett.,2000,44(6):347-351. [33] CHEN Q J,IMEN K,ALLEN S D. Laser enhanced electroless plating of micron-scale copper wires[J]. J. Electrochem. Society,2000,147(4):1418-1422. [34] KORDS K,NNAI L,GALBC S G,et al.. Reaction dynamics of CW Ar+ laser induced copper dirct writing from liquid electrolyte on polyimide substrates[J]. Appl. Surface Sci.,2000,158(1):127-133. [35] KORD S K,BALI K,LEPP VUORI S,et al.. Laser direct writing of copper on polyimide surfaces from solution[J]. Appl. Surface Sci.,2000,154-155:399-404. [36] SZRéNYI T,GERETOVSZKY Z,T TH J,et al.. Laser direct writng of tin oxide patterns[J]. Vacuum,1998,50(3-4):327-329. [37] TOFTMANN B,PAPANTONAKIS M R,AUYEUNG R C Y,et al.. UV and RIR matrix assisted pulsed laser deposition of organic MEH-PPV films[J]. Thin Solid Films,2004,453-454:177-181. [38] CHRISEY D B,PIQUE A,MODI R,et al.. Direct writing of conformal mesoscopic electronic devices by MAPLE DW[J]. Appl. Surface Sci.,2000,168(1-4):345-352. [39] SANO T,YAMADA H,NAKAYAMA T,et al.. Laser induced rear ablation of metal thin films[J]. SPIE,2002,4426:70-73.
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出版历程
  • 收稿日期:  2010-03-11
  • 修回日期:  2010-05-13
  • 刊出日期:  2010-10-25

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