Volume 14 Issue 3
May  2021
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Chinese Optics  > 2021  >  14(3): 670-684.
WU Fu-pei, XIE Xiao-yang, LI Sheng-ping. A thermal dissipation design method for LED array structure illumination[J]. Chinese Optics, 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211
Citation: WU Fu-pei, XIE Xiao-yang, LI Sheng-ping. A thermal dissipation design method for LED array structure illumination[J]. Chinese Optics, 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211
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A thermal dissipation design method for LED array structure illumination

  • Department of Mechanical Engineering, Shantou University, Shantou 515063, China

Funds:  Supported by National Natural Science Foundation of China (No. 61573233); Natural Science Foundation of Guangdong, China (No. 2021A1515010661; No. 2018A0303130188); Guangdong Science and Technology Special Funds Project (No. 190805145540361); Special Projects in Key Fields of Colleges and Universities in Guangdong Province (No. 2020ZDZX2005)
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  • Author Bio:

    WU Fu-pei (1980—), male, was born in Yulin, Guangxi province. He received the Ph.D. in mechanical engineering from South China University of Technology, Guangzhou, China, in 2009, and now he works in Department of Mechanical Engineering as an associate professor, Shantou University, Shantou, China. His research interests include illumination design, automated optical inspection, and machine vision. E-mail: fpwu@stu.edu.cn

    LI Sheng-ping (1966—), male, was born in Yongzhou, Hunan province. He received a bachelor's degree from Wuhan University of Technology in 1987, a master's degree from Beijing University of Technology in 1992 and a doctorate from Huazhong University of Science and Technology in 1995. He is now a professor at Shantou University. His main research fields are adaptive control, robust control, robust design theory and application, machine vision. E-mail: spli@stu.edu.cn. Corresponding author

  • Corresponding author: spli@stu.edu.cn
  • Received Date: 03 Dec 2020
  • Rev Recd Date: 08 Jan 2021
    • Available Online: 27 Mar 2021
  • Publish Date: 14 May 2021
    Abstract
  • Obtaining high-quality images plays an important role in active automatic optical inspection systems. Besides cameras, image quality is significantly affected by the illumination thermal stability. To ensure the illumination thermal stability and capture high-quality images in optical inspection systems, a thermal dissipation design method for LED array structure illumination is proposed in this paper. Firstly, the thermal resistance model of a single LED is built by analyzing its thermal resistance characteristics. Secondly, a setup with two adjacent LEDs is taken as an example to analyze junction temperature characteristics of the same color light in a LED array, and then the junction temperature model of the LED array structure illumination is developed. Finally, the thermal dissipation design method for LED array structure illumination is illustrated based on the proposed junction temperature model. Especially, the thermal design method is decomposed into two sub-problems to simplify the design process. Experimental results show that the junction temperature deviation is within −0.33%~0.33% by simulation and is 2.28% by experiment, which validates the effectiveness of the proposed method.

     

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    • References(25)
  • [1]
    SUN X H, GU J A, TANG SH X, et al. Research progress of visual inspection technology of steel products-a review[J]. Applied Sciences, 2018, 8(11): 2195. doi: 10.3390/app8112195
    [2]
    WU F P, LI SH P, ZHANG X M, et al. A design method for LEDs arrays structure illumination[J]. Journal of Display Technology, 2016, 12(10): 1177-1184. doi: 10.1109/JDT.2016.2593770
    [3]
    WU X J, GAO G M. LED light design method for high contrast and uniform illumination imaging in machine vision[J]. Applied Optics, 2018, 57(7): 1694-1704. doi: 10.1364/AO.57.001694
    [4]
    QU X H, LIU Q, WANG H, et al. System-level lifetime prediction for LED lighting applications considering thermal coupling between LED sources and drivers[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2018, 6(4): 1860-1870. doi: 10.1109/JESTPE.2018.2850845
    [5]
    WANG X X, JING L, WANG Y, et al. The influence of junction temperature variation of LED on the lifetime estimation during accelerated aging test[J]. IEEE Access, 2019, 7: 4773-4781. doi: 10.1109/ACCESS.2018.2885578
    [6]
    HUANG D S, CHEN T C, TSAI L T, et al. Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights[J]. Energy Conversion and Management, 2019, 180: 550-558. doi: 10.1016/j.enconman.2018.11.021
    [7]
    KIM M Y, KOH K I. Shadow-free moire interferometer with dual projection for in-line inspection of light emitting diodes[J]. International Journal of Optomechatronics, 2007, 1(4): 404-424. doi: 10.1080/15599610701771645
    [8]
    WU F P, ZHANG X M. An inspection and classification method for chip solder joints using color grads and Boolean rules[J]. Robotics and Computer-Integrated Manufacturing, 2014, 30(5): 517-526. doi: 10.1016/j.rcim.2014.03.003
    [9]
    WU H. Solder joint defect classification based on ensemble learning[J]. Soldering &Surface Mount Technology, 2017, 29(3): 164-170.
    [10]
    SONG J D, KIM Y G, PARK T H. SMT defect classification by feature extraction region optimization and machine learning[J]. The International Journal of Advanced Manufacturing Technology, 2019, 101(5-8): 1303-1313. doi: 10.1007/s00170-018-3022-6
    [11]
    HUANG C H, WANG G J. A design problem to estimate the optimal fin shape of LED lighting heat sinks[J]. International Journal of Heat and Mass Transfer, 2017, 106: 1205-1217. doi: 10.1016/j.ijheatmasstransfer.2016.10.101
    [12]
    XIANG J H, ZHANG CH L, ZHOU CH, et al. Heat transfer performance testing of a new type of phase change heat sink for high power light emitting diode[J]. Journal of Central South University, 2018, 25(7): 1708-1716. doi: 10.1007/s11771-018-3862-0
    [13]
    JANG H, LEE J H, BYON C, et al. Innovative analytic and experimental methods for thermal management of SMD-type LED chips[J]. International Journal of Heat and Mass Transfer, 2018, 124: 36-45. doi: 10.1016/j.ijheatmasstransfer.2018.03.055
    [14]
    MOU Y, WANG H, PENG Y, et al. Enhanced heat dissipation of high-power light-emitting diodes by Cu nanoparticle paste[J]. IEEE Electron Device Letters, 2019, 40(6): 949-952. doi: 10.1109/LED.2019.2912458
    [15]
    WANG Y W, CEN J W, CAO W J, et al. Thermal performance of direct illumination high-power LED backlight units with different assembling structures[J]. Heat and Mass Transfer, 2017, 53(5): 1619-1630. doi: 10.1007/s00231-016-1925-z
    [16]
    TIAN CH, GUO SH X, LIANG J Q, et al. Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device[J]. Optoelectronics Letters, 2017, 13(4): 282-286. doi: 10.1007/s11801-017-7048-z
    [17]
    BAN ZH, LIANG ZH ZH, LIANG J Q, et al. Thermal analysis and design of AlGaInP-based light emitting diode arrays[J]. Current Optics and Photonics, 2017, 1(2): 143-149. doi: 10.3807/COPP.2017.1.2.143
    [18]
    BEN ABDELMLEK K, ARAOUD Z, CHARRADA K, et al. Optimization of the thermal distribution of multi-chip LED package[J]. Applied Thermal Engineering, 2017, 126: 653-660. doi: 10.1016/j.applthermaleng.2017.07.136
    [19]
    Dassault Systèmes SolidWorks Corporation. SOLIDWORKS 2016[CP/DK]. Waltham, USA: Dassault Systèmes SolidWorks Corporation, 2015.
    [20]
    ANSYS, Incuk. ANSYS 16.0[CP/DK]. Canonsburg, USA: ANSYS, Incuk, 2015.
    [21]
    XIE L H, CAI S Q. ANSYS Workbench 17.0 Finite Element Analysis and Simulation[M]. 2nd ed. Beijing: Publishing House of Electronics Industry, 2017. (in Chinese)
    [22]
    SHE J, YANG W, YU T B, et al. Thermal analysis of LED filaments with three types of chip distributions[J]. Journal of Nanchang University (Engineering &Technology), 2017, 39(3): 289-293, 306. (in Chinese)
    [23]
    LI Y F, ZOU J. Application of LED Thermal Management and Heat Dissipation Technology[M]. Shanghai: Shanghai Scientific & Technical Publishers, 2018. (in Chinese)
    [24]
    CHAI G Y, LI B, WANG G, et al.. Thermal Management of LED’s Packaging and Light Engine[M]. Beijing: Tsinghua University Press, 2018. (in Chinese)
    [25]
    CHEN Y C, WEN SH SH, WU Y X. Thermal analysis for LED chip on board package based on plastic radiator without substrate[J]. Acta Optica Sinica, 2013, 33(8): 0823005. (in Chinese) doi: 10.3788/AOS201333.0823005
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