Volume 4 Issue 2
Apr.  2011
Turn off MathJax
Article Contents
GUO Liang, WU Qing-wen, CAO Qi-peng, YAN Chang-xiang, CHEN Li-heng, WANG Ling-hua, LIU Wei-yi. Thermal design and simulation analysis of electronic controlling cabinet in space camera[J]. Chinese Optics, 2011, 4(2): 129-138.
Citation: GUO Liang, WU Qing-wen, CAO Qi-peng, YAN Chang-xiang, CHEN Li-heng, WANG Ling-hua, LIU Wei-yi. Thermal design and simulation analysis of electronic controlling cabinet in space camera[J]. Chinese Optics, 2011, 4(2): 129-138.

Thermal design and simulation analysis of electronic controlling cabinet in space camera

  • Received Date: 11 Dec 2010
  • Rev Recd Date: 13 Feb 2011
  • Publish Date: 25 Apr 2011
  • To ensure the operating temperature of electronic controlling cabinet in a space camera to satisfy the operating requirements, the thermal design of large power consumption electronic components in the electronic controlling cabinet was performed according to the design feature and heat transfer path of the controlling cabinet. The key problems such as the great heat-producing capability and long heat transfer path were settled. On the basis of the above, a complete thermal design scheme was given. By taking some classical elements for examples, the effect of heat eliminating was estimated. In the end, a thermal analysis finite element model was established by a finite element thermal analysis software IDEAS-TMG. Based on the given temperature boundary condition, the steady-state thermal analysis of electric cabinet was carried out by the IDEAS-TMG, and the integral thermal response performance of electronic controlling cabinet and the steady-state temperature profiles of PCBs and large power consumption elements were given. It is shown that the ranges of temperatures of PCBs and large power consumption electronic components in steady-state thermal analysis are 40.6-51.1 ℃ and 46.3-62.5 ℃, respectively, which reaches the target of thermal design. Analytical results indicate that the thermal design scheme for the electronic controlling cabinet is appropriate and feasible and it can satisfy the requirement of thermal control operating.

     

  • loading
  • [1] 平丽浩, 钱吉裕, 徐德好. 电子装备热控新技术综述(上)[J]. 电子机械工程 ,2008,24(1):1-10. PING L H,QIAN J Y,XU D H. A review of the thermal control technologies for electronic systems:part I[J]. Electro-Mechanical Eng.,2008,24(1):1-10.(in Chinese) [2] 吕永超, 杨双根. 电子设备热分析、热设计及热测试技术综述及最新进展[J]. 电子机械工程 ,2007,23(1):5-10. LV Y CH,YANG SH G. A review of thermal analysis,thermal design and thermal test technology and their recent development [J]. Electro-Mechanical Eng.,2007,23(1):5-10.(in Chinese) [3] 付桂翠,高泽溪,方志强,等. 电子设备热分析技术研究[J]. 电子机械工程 ,2004,20(1):13-16. FU G C,GAO Z X,FANG ZH Q,et al.. A study on thermal analysis of electronic system[J]. Electro-Mechanical Eng.,2004,20(1):13-16.(in Chinese) [4] 黄冬梅,童永光,蔡巧言. 空间环境下某电子产品的热设计[J]. 导弹与航天运载技术 ,2005,5:48-50. HUANG D M,TONG Y G,CAI Q Y. Thermal design of electronic product under space environment[J]. Missiles and Space Vehicles,2005,5:48-50.(in Chinese) [5] 齐迎春,许艳军,赵运隆. 空间遥感器电子学单机热分析[J]. 长春理工大学学报(自然科学版) ,2009,32(3):366-369. QI Y CH,XU Y J,ZHAO Y L. Thermal analysis for the electric box of the space remote-sensor[J]. J. Changchun University of Science and Technology(Natural Science Edition),2009,32(3):366-369.(in Chinese) [6] HARVEST J,FLESCHER S A,WEINTSTEIN R D. Modeling of the thermal effects of heat generating devices in close proximity on vertically oriented printed circuit boards for thermal management applications[J]. International J. Thermal Sci.,2007,46(3):253-261. [7] VELLVEHI M,JORDA X,GODIGNON P,et al.. Coupled electro-thermal simulation of a DC/DC converter[J]. Microelectronics Reliability,2007,47(12):2114-2121. [8] 薛军,陈文礼,吴澜涛,等. 基于有限元法的空间相机CCD电箱热控研究[J]. 光学技术 ,2008,34(6):851-853. XUE J,CHEN W L,WU L T,et al.. Research of the thermal control in the CCD electric box of the space camera based on finite element method[J]. Opt. Technique,2008,34(6):851-853.(in Chinese) [9] 何恩,朱敏波,曹峰云. 星载电子设备热分析系统的应用[J]. 电子机械工程 ,2004,20(1):8-10. HE E,ZHU M B,CAO F Y. Application of thermal analysis system to electronic equipment on satellite[J]. Electro-Mechanical Eng.,2004,20(1):8-10.(in Chinese) [10] 陈立恒,吴清文,罗志涛,等. 空间相机电子设备热控系统设计[J]. 光学 精密工程 ,2009,17(9):2145-2152. CHEN L H,WU Q W,LUO ZH T,et al.. Design for thermal control system of electronic equipment in space camera[J]. Opt. Precision Eng.,2009,17(9):2145-2152.(in Chinese) [11] 许艳军,齐迎春,任健岳. 空间遥感器电子学系统热分析[J]. 电子机械工程 ,2009,25(2):12-15. XU Y J,QI Y CH,REN J Y. Thermal analysis of space electronic sensor system[J]. Electro-Mechanical Eng.,2009,25(2):12-15.(in Chinese) [12] 陈佶,孙汉旭,贾庆轩,等. 空间机电产品热设计[J]. 现代机械 ,2006,3:61-108. CHEN J,SUN H X,JIA Q X,et al.. The thermal design of space mechatronic products[J]. Modern Machinery,2006,3:61-108.(in Chinese) [13] 薛军,孙宝玉,吴澜涛,等. 空间相机CCD电箱热分析计算[J]. 长春工业大学学报(自然科学版) ,2008,29(2):212-216. XUE J,SUN B Y,WU L T,et al.. Thermal analysis for the CCD electric box of the space camera[J]. J. Changchun University of Technology(Natural Science Edition),2008,29(2):212-216.(in Chinese) [14] 常春国. 结构设计在电子设备中的重要性研究[J]. 电子质量 ,2009(12):48-49. CHANG CH G. Study on the importance of structure design in electronic equipments[J]. Electronics Quality,2009(12):48-49.(in Chinese) [15] 何菊. 某星载电子设备结构设计简述[J]. 中国科技信息 ,2010(5):45-54. HE J. Structural design compendium of an electronic equipment on satellite[J]. China Science and Technology Information,2010(5):45-54.(in Chinese) [16] 朱金彪. 一种星载电子设备散热结构的设计与优化[J]. 电子机械工程 ,2008,24(4):11-13. ZHU J B. Design and optimization of spaceborne electronic equipment's heatspreader structure[J]. Electro-Mechanical Eng.,2008,24(4):11-13.(in Chinese)
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索
    Article views(4815) PDF downloads(1426) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return