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摘要:
激光清洗技术作为一种高效、环保的表面处理手段，在芯片封装模具清洗领域具有重要的应用潜力。本研究系统探究了激光参数（脉冲宽度、重复频率、平均功率）对 P20 合金和 ASP23 合金镀铬模具表面环氧塑封料 (EMC) 污染物的清洗效果影响。实验采用
1064 nm掺钕脉冲激光器，将高斯光束整形为平顶光束，结合振镜"弓"字扫描路径，以单一变量法优化工艺参数。实验结果表明，激光能量密度为 0.55−0.77 J/cm2 时，脉冲宽度与重复频率需协同调节以平衡热输入，可实现污染物完全去除且基材零损伤。参数敏感性分析显示，最佳占空比范围为 0.8%~1.0%。此外，功率超过阈值（150 ns，50%或200 ns，50%）会导致基材损伤，这表明参数匹配对清洗效果与材料保护至关重要。本研究为芯片封装模具提供了一种高精度、非接触的绿色清洗方案，验证了激光清洗技术在集成电路领域的可行性。Abstract:Laser cleaning technology, as an efficient and environmentally friendly surface treatment method, plays significant application potential in the field of chip packaging molds cleaning. This research systematically investigated the influence of laser parameters (pulse duration, repetition frequency and average power) on the cleaning effect of chromium-plated mold surface epoxy encapsulation materials (EMC) contaminated by P20 alloy and ASP23 alloy. The experiment employed a
1064 nm neodymium-doped pulsed laser, reshaping the Gaussian beam into a flat-top beam, and combining with a "bow" shape scanning path of the galvanometer mirror. The process parameters were optimized using a single-variable method. The experimental results indicated that when the laser energy density was between 0.55 and 0.77 J/cm2, the pulse duration and repetition rate needed to be adjusted in coordination to balance the thermal input, enabling complete removal of contaminants without any damage to the substrate. Parameter sensitivity analysis revealed that the optimal duty cycle range was from 0.8% to 1.0%. Furthermore, when the power exceeded the threshold (150 ns@50% average power or 200 ns@50% average power), it may cause damage to the substrate, which indicated that laser parameter matching was crucial for the cleaning effect and material protection. This research provided a high-precision, non-contact and environmentally friendly cleaning solution for chip packaging molds, and verified the feasibility of laser cleaning technology in the field of integrated circuits.-
Key words:
- laser cleaning technology /
- chip packaging mold /
- duty cycle /
- surface treatment
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图 1 激光器多模和单模激光光束能量仿真图
Figure 1. Simulation diagrams of laser beam energy for multimode and single-mode lasers
图 2 （a）模具污染局部图；（b）模具原始局部图
Figure 2. (a) Partial view of mold contamination; (b) Partial view of pristine mold
图 4 脉宽 150 ns和重频 54 kHz，功率分别为最大功率的(a) 10%、(b) 20%、(c) 30%、(d) 40%、(e) 50%、(f) 60%、(g) 70%、(h) 80%时，激光清洗显微镜样貌图
Figure 4. Microscopic images of laser-cleaned surfaces with a pulse duration of 150 ns and repetition rate of 54 kHz, with power levels of (a) 10%, (b) 20%, (c) 30%, (d) 40%, (e) 50%, (f) 60%, (g) 70%, and (h) 80%
图 5 固定脉宽为150 ns，重频为54 kHz时，功率分别为最大功率的(a) 30%、(b) 32.5%、(c) 35%、(d) 37.5%、(e) 40%激光清洗显微镜样貌图
Figure 5. Microscopic images of laser-cleaned surfaces at a pulse duration of 150 ns and repetition rate of 54 kHz, with power levels of (a) 30%, (b) 32.5%, (c) 35%, (d) 37.5%, and (e) 40%
图 6 脉宽150 ns，重频54 kHz时，单脉冲能量最佳范围图
Figure 6. Optimal range of single-pulse energy at a pulse duration of 150 ns and repetition rate of 54 kHz
图 7 脉宽200 ns 和重频45 kHz时，功率分别为最大功率的(a) 15%、(b) 20%、(c) 25%、(d) 30%、(e) 35%、(f) 40%、(g) 45%、(h) 50%激光清洗显微镜样貌图
Figure 7. Microscopic morphology images of laser cleaning with pulse duration of 200 ns, repetition frequency of 45 kHz, and powers of (a) 15%, (b) 20%, (c) 25%, (d) 30%, (e) 35%, (f) 40%, (g) 45%, (h) 50%.
图 8 脉宽200 ns、重频45 kHz时，功率分别为最大功率的(a) 25%、(b) 27.5%、(c) 30%、(d) 32.5%、(e) 35%对应的激光清洗显微镜样貌
Figure 8. Microscopic morphology of laser cleaning with a pulse width of 200 ns, a repetition frequency of 45 kHz, and powers of (a) 25%, (b) 27.5%, (c) 30%, (d) 32.5%, (e) 35%.
图 9 脉宽 200 ns，重频 45 kHz时，单脉冲能量最佳范围
Figure 9. When the pulse duration is 200 ns and repetition frequency is 45 kHz, the optimal ranges of single pulse energy.
图 10 脉宽150 ns和功率175 W (35%)，重复频率分别为 24 kHz、 34 kHz、 44 kHz、 54 kHz、 64 kHz、 74 kHz激光清洗显微镜样貌图
Figure 10. Microscopic images of laser cleaning with a pulse width of 150 ns and a power of 175 W (35%), and repetition frequencies of 24 kHz, 34 kHz, 44 kHz, 54 kHz, 64 kHz, and 74 kHz.
图 11 脉宽 200 ns和功率 175 W (35%)，重复频率分别为 15 kHz、 25 kHz、 35 kHz、 45 kHz、 55 kHz、 65 kHz激光清洗显微镜样貌图
Figure 11. Microscopic morphology images of laser cleaning with a pulse duration of 200 ns, power of 175 W (35%), and repetition frequencies of 15 kHz, 25 kHz, 35 kHz, 45 kHz, 55 kHz, 65 kHz.
表 1 激光器单模和多模清洗效果对比
Table 1. Comparison of Single-Mode and Multimode Laser Cleaning effect.
激光模式 能量分布 工作能力 工作效率 基材损伤 适用场景 单模 中间强，两翼弱 强 较差 有/轻微 除锈 多模 分布均匀 较差 强 轻微/无 模具 
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表 2 激光器和清洗系统参数
Table 2. Parameters of the laser and cleaning system
名称 数值 单位 波长（λ） 1064 nm 平均功率（P） 0-500 W 脉冲宽度（w） 30-500 ns 单脉冲能量（Pe） 0-50 mJ 重复频率（f） 1- 4000 kHz 振镜规格 110*110 mm
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表 3 脉宽 150 ns 和重频 54 kHz下，不同功率对应单脉冲能量的值
Table 3. Single-pulse energy at different power levels under a pulse duration of 150 ns and a repetition rate of 54 kHz
功率（500 W） 单脉冲能量（mJ） 功率（500 W） 单脉冲能量（mJ） 10% 0.93 30.0% 2.78 20% 1.85 32.5% 3.01 30% 2.78 35.0% 3.24 40% 3.70 37.5% 3.47 50% 4.63 40.0% 3.70 60% 5.56 \ \ 70% 6.48 \ \ 80% 7.41 \ \
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表 4 脉宽200 ns和重频 45 kHz时不同功率对应单脉冲能量
Table 4. Single-pulse energy at different power levels under a pulse width of 200 ns and a repetition rate of 45 kHz
功率（500 W） 单脉冲能量（mJ） 功率（500 W） 单脉冲能量（mJ） 20% 2.22 25% 2.78 25% 2.78 27.5% 3.06 30% 3.33 30% 3.33 35% 3.89 32.5% 3.61 40% 4.44 35.0% 3.89 45% 5.00 \ \ 50% 5.56 \ \ 55% 6.11 \ \
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