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面向热敏感基底的低温高性能镀膜工艺研发

林柏竹 叶明

林柏竹, 叶明. 面向热敏感基底的低温高性能镀膜工艺研发[J]. 中国光学(中英文). doi: 10.37188/CO.2025-0139
引用本文: 林柏竹, 叶明. 面向热敏感基底的低温高性能镀膜工艺研发[J]. 中国光学(中英文). doi: 10.37188/CO.2025-0139
LIN Bai-zhu, YE Ming. Development of a low-temperature, high-performance coating process for heat-sensitive substrates[J]. Chinese Optics. doi: 10.37188/CO.2025-0139
Citation: LIN Bai-zhu, YE Ming. Development of a low-temperature, high-performance coating process for heat-sensitive substrates[J]. Chinese Optics. doi: 10.37188/CO.2025-0139

面向热敏感基底的低温高性能镀膜工艺研发

cstr: 32171.14.CO.2025-0139
基金项目: 智能轻型超大幅宽高分辨遥感卫星及数据处理技术(No. 2025JLGJ0013GX);长光卫星技术股份有限公司光学镀膜均匀性修正程序开发项目(No. ZYGCAFKY02024101002)
详细信息
    作者简介:

    林柏竹(1994—),女,吉林长春人,博士,工程师,2022年于吉林大学获得博士学位,现为长光卫星技术股份有限公司光学加工技术研究室员工,主要从事光学薄膜的设计、研制和空间应用方面的研究工作。E-mail:linbaizhu@jl1.cn

  • 中图分类号: TP394.1;TH691.9

Development of a low-temperature, high-performance coating process for heat-sensitive substrates

Funds: Supported by Intelligent Lightweight Ultra-Wide Swath High-Resolution Remote Sensing Satellite and Data Processing Technology (No. 2025JLGJ0013GX); Chang Guang Satellite Technology Co., Ltd. Optical Coating Uniformity Correction Procedure Development Project (No. ZYGCAFKY02024101002)
  • 摘要:

    针对热敏感基底(如环氧胶粘接结构件)在镀膜过程中的温升控制难题,本文提出一种低温电子束蒸发镀膜工艺。通过分段沉积-冷却循环的动态热管理策略,系统研究了该工艺在金属反射膜(以银膜为研究对象)的应力、附着力及光学等核心性能方面的表现,并结合环氧胶热失效阈值优化沉积流程。实验结果表明,在基片温度严格受控的条件下,该工艺使得反射膜残余应力显著降低,界面附着力满足国家标准中最严苛的03严酷等级(GB/T 26332.4-2015/ISO 9211-4:2012),在可见光波段,其平均反射率与传统连续镀膜工艺相当(>99%@450~900 nm),且基片温升始终低于环氧胶临界阈值。通过离子辅助沉积与介质层封装协同作用,银膜抗氧化性与环境耐受性显著提升,满足航天光学器件在极端多物理场耦合环境下的长寿命服役要求。进一步理论分析表明,该工艺的热弛豫机制与结构调控原理具备跨场景适用性,为低温敏感基材的高性能镀膜提供了兼顾航天可靠性及工业普适性的创新解决方案。

     

  • 图 1  初始温度分别为(a)22 °C和(b)30 °C下的表面应力云图

    Figure 1.  Contour plots of surface stress at initial temperatures of (a) 22 °C and (b) 30 °C

    图 2  连续镀膜过程实时温度监测曲线

    Figure 2.  Real-time temperature monitoring curve of the continuous coating process

    图 3  单层介质膜镀膜实时温升曲线。(a)SiO2和(b)TiO2的温升-厚度关系

    Figure 3.  Real-time temperature rise as a function of film thickness during the deposition of single-layer dielectric film (a) SiO2 and (b) TiO2

    图 4  薄膜内部结构。(a)SiO2薄膜和(b)TiO2薄膜

    Figure 4.  Internal structure of thin films. (a) SiO2 and (b) TiO2

    图 5  膜层牢固度检测。(a)SiO2薄膜和(b)TiO2薄膜

    Figure 5.  Adhesion strength test of the film layers. (a) SiO2 and (b) TiO2 thin films

    图 6  理论设计/实际镀制反射光谱对比图

    Figure 6.  Comparison between the theoretically designed and experimentally deposited reflective spectra

    图 7  分段控温镀膜过程实时温度监测曲线

    Figure 7.  Real-time temperature monitoring curve for the film deposition process under segmented temperature control

    图 8  镀膜前后基片曲率测量。(a)连续和(b)分段镀膜工艺

    Figure 8.  Substrate curvature measurements before and after film deposition. (a) Continuous and (b) multi-step deposition processes

    图 9  胶粘试验装置

    Figure 9.  Adhesion test apparatus

    图 10  分段/连续工艺下反射光谱对比图

    Figure 10.  Comparison of the reflective spectra under segmented and continuous thin-film deposition processes

    图 11  各阶段膜层表面形貌。(a)试验前;(b)第一阶段试验后;(c)第二阶段试验后

    Figure 11.  Surface morphology of the film at different stages. (a) Before the test; (b) after the first stage of the test; (c) after the second stage of the test

    图 12  原子氧试验前后反射光谱对比曲线

    Figure 12.  Comparison of the reflective spectra before and after atomic oxygen exposure tests

    表  1  多物理场耦合环境模拟试验前后光谱变化和膜层情况汇总

    Table  1.   Summary of spectral changes and film condition before and after the multi-physics coupled environment simulation test

    连续镀膜工艺(样品
    编号:1#、2#、3#、4#)
    分段控温镀膜工艺
    (样品编号:5#、6#、7#、8#)
    ΔR̄ 脱膜情况 ΔR̄ 脱膜情况
    高低温循环实验 0.11% 0.08%
    振动实验 0.08% 0.04%
    恒定高温试验 0.11% 0.10%
    温湿度试验 0.12% 0.12%
    下载: 导出CSV
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