3D small-field surface imaging based on microscopic fringe projection profilometry:a review
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摘要: 智能制造不断向着精密化、微型化、集成化的方向发展,具有代表性的集成电路技术及其衍生出的MEMS等微型传感器技术等得以迅猛发展,快速精确地获取微型器件表面信息并进行缺陷检测对于集成电路和MEMS等产业发展具有重要意义。基于结构光的条纹投影技术具有非接触、高精度、高效率、全场测量等优点,在精密测量中发挥着重要的作用。近年来,显微条纹投影测量系统,包括其光学系统结构,系统标定,相位获取以及三维重建方法等各个方面取得了重大发展。本文回顾了显微条纹投影三维测量系统的结构原理,分析了不同于传统投射模型的小视场系统标定问题,介绍了显微投影系统结构发展过程,同时对由系统结构以及金属测量时造成的反光问题进行了分析,在此基础上,对显微条纹投影三维测量系统的发展前景进行了展望。Abstract: Intelligent manufacturing has become more precise, miniaturized and integrated. Representative integrated circuit technology and its derived miniature sensors such as Micro-Electro-Mechanical System (MEMS) have become widely used. Therefore, it is important for intelligent manufacturing development to accurately obtain the surface morphology information of micro-devices and implement rapid detection of device surface defects. Fringe Projection Profilometry (FPP) based on structural light projection has the advantages of being non-contact, highly precise, highly efficient and having full-field measurement, which plays an important role in the field of precision measurement. Microscopic Fringe Projection Profilometry (MFPP) has been developed rapidly during recent decades. In recent years, MFPP has made great progress in many aspects, including its optical system structures, corresponding system calibration methods, phase extraction algorithms, and 3D coordinate reconstruction methods. In this paper, the structure and principle of a three-dimensional measurement system of microscopic fringe projection are reviewed, and the calibration problem of a small field-of-view system that is different from the traditional projection model is analyzed. After that, the development and improvement process of the micro-projection system structure is introduced, and the reflection in the measurment caused by the system structure and metal material is analyzed. On this basis, the prospects of the development of microscopic fringe projection of 3D measurement system are discussed.
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表 1 基于体视显微镜的MFPP系统的比较
Table 1. Comparison of MFPP systems based on off-the-shelf microscopes
文章 投影技术 系统复杂度 测量视场大小 Leonhardt等[7] Ronchi光栅 高 0.10 mm×0.10 mm~
2.50 mm×2.50 mmProll等[9] LCD芯片 高 1.40 mm×1.00 mm~
16.5 mm×12.0 mmZhang等[12] DMD芯片 高 1.20 mm×0.90 mm~
7.60 mm×5.70 mmProll等[9] LCOS芯片 高 0.83 mm×0.62 mm~
21.2 mm×15.7 mmChen等[30] DLP投影仪 中 未给出 Li等[31] LCOS投影仪 中 3.0 mm×3.0 mm(变倍可调) 肖[28] LightCrafter 中 20.0 mm×15.0 mm(变倍可调) Jeught等[29] LightCrafter 低 10.7 mm×8.0 mm(变倍可调) Hu等[26] LightCrafter 低 8.0 mm×6.0 mm(变倍可调) 表 2 基于LWD镜头的MFPP系统对比
Table 2. Comparison of MFPP systems based on an LWD lens
文章 投影技术 长工作距离镜头类型 测量视场大小 Quan等[8] LCD投影 针孔+针孔镜头 1.2 mm×1.5 mm Quan等[38] 精细的正弦光栅 针孔+针孔镜头 0.1 mm×0.1 mm Wang等[39] LCD投影 针孔+针孔镜头 768 pixel×576 pixel Yin等[34] DLP投影 针孔+针孔镜头 5.0 mm×4.0 mm Li等[20] LightCrafter 针孔+远心镜头 10.0 mm×8.0 mm Li等[32] DLP投影仪 远心+远心镜头 30.0 mm×20.0 mm Liu等[21] LCD投影仪 远心+远心镜头 34.6 mm×29.0 mm Peng等[33] DMD芯片 远心+远心镜头 1280 pixel×
1024 pixelWang等[35] DMD芯片 远心+4个远心镜头 1280 pixel×
1024 pixelHu等[36] LightCrafter 远心+2个远心镜头 10.0 mm×7.0 mm 表 3 两类MFPP系统对比
Table 3. Comparison of the two kinds of method for MFPP
基于立体显微镜的MFPP 基于LWD透镜的MFPP 优点 灵活调整放大率
良好的景深
仅单相机系统
条纹对比度高良好的景深
标定结构简单
结构紧凑缺点 系统体积大
构造复杂
标定费时放大倍数固定
公共视野受限适用领域 需要快速调整
视场的被测物表面形貌复杂,小空间
物体测量表 4 HDR 技术中各类方法的优缺点对比
Table 4. Comparison of typical methods in HDR technology
文章 实现方法 优点 缺点 适用范围 Zhang等[47] 相机多重曝光法 测量精度和信噪比较高,不需要搭建额外的硬件系统 大范围反射率变化表面需采集大量的条纹图像,测量效率降低,未知场景有一定的盲目性 复杂纹理表面;多颜色的表面;反射率变化不大表面;静态物体 Chen等[48] 调整投影图案强度法 高信噪比,不受环境
约束对未知的场景有一定的盲目性,测量效率低,不能自动预测参数 复杂纹理表面;多颜色的表面;反射率变化不大表面;静态物体 Feng等[54] 偏振滤光片法 测量精度高 信噪比低,空间分辨率降低,硬件系统相对复杂 镜面物体测量;快速动态测量 Benveniste R等[56] 颜色不变量法 无需前期参数设置 容易受到表面颜色和复杂纹理的影响,精度低 快速动态测量 Meng等[58] 光度立体技术 测量精度高 系统结构的限制,单次测量的表面范围很小 小范围物体测量;静态物体 -
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