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A thermal dissipation design method for LED array structure illumination

WU Fu-pei XIE Xiao-yang LI Sheng-ping

吴福培, 谢晓扬, 李昇平. 一种散热型发光二极管阵列结构光源设计方法[J]. 中国光学(中英文), 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211
引用本文: 吴福培, 谢晓扬, 李昇平. 一种散热型发光二极管阵列结构光源设计方法[J]. 中国光学(中英文), 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211
WU Fu-pei, XIE Xiao-yang, LI Sheng-ping. A thermal dissipation design method for LED array structure illumination[J]. Chinese Optics, 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211
Citation: WU Fu-pei, XIE Xiao-yang, LI Sheng-ping. A thermal dissipation design method for LED array structure illumination[J]. Chinese Optics, 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211

一种散热型发光二极管阵列结构光源设计方法

详细信息
  • 中图分类号: TM923.34

A thermal dissipation design method for LED array structure illumination

doi: 10.37188/CO.2020-0211
Funds: Supported by National Natural Science Foundation of China (No. 61573233); Natural Science Foundation of Guangdong, China (No. 2021A1515010661; No. 2018A0303130188); Guangdong Science and Technology Special Funds Project (No. 190805145540361); Special Projects in Key Fields of Colleges and Universities in Guangdong Province (No. 2020ZDZX2005)
More Information
    Author Bio:

    WU Fu-pei (1980—), male, was born in Yulin, Guangxi province. He received the Ph.D. in mechanical engineering from South China University of Technology, Guangzhou, China, in 2009, and now he works in Department of Mechanical Engineering as an associate professor, Shantou University, Shantou, China. His research interests include illumination design, automated optical inspection, and machine vision. E-mail: fpwu@stu.edu.cn

    LI Sheng-ping (1966—), male, was born in Yongzhou, Hunan province. He received a bachelor's degree from Wuhan University of Technology in 1987, a master's degree from Beijing University of Technology in 1992 and a doctorate from Huazhong University of Science and Technology in 1995. He is now a professor at Shantou University. His main research fields are adaptive control, robust control, robust design theory and application, machine vision. E-mail: spli@stu.edu.cn. Corresponding author

    Corresponding author: spli@stu.edu.cn
  • 摘要: 在主动式自动光学检测系统中,获取高质量的图像具有重要意义。除相机外,光源热稳定性对获取的图像质量也会产生重要影响。为了确保光学检测系统光源的热稳定性以获取高质量的图像,论文提出了一种散热型LED阵列结构光源设计方法。首先,基于单个LED热阻特性建立单个LED的热阻模型。其次,以两个相邻的LED为例,分析同色光LED在单一阵列中的结温特性,并建立LED阵列结构光源的结温模型。最后,基于建立的结温模型,提出散热型LED阵列结构光源设计方法。特别地,论文提出了将散热型结构光源设计问题分解为两个相对简单子问题的方法,进而简化结构光源设计过程。实验结果表明,该设计方法的仿真结温偏差在−0.33%~0.33%之间,实验结温偏差为2.28%,验证了该方法的有效性。

     

  • Figure 1.  The 3D model of a single LED

    Figure 2.  Surface temperature distribution of a single LED model

    Figure 3.  Simulation results of the model with two adjacent LEDs

    Figure 4.  The model of LED ring structure illumination

    Figure 5.  Top view for the zeroth layer LED array of ring illumination

    Figure 6.  The thermal dissipation design process of multi-layer LED arrays

    Figure 7.  The 3D model of strip-type structure illumination

    Figure 8.  The thermal model of strip-type structure illumination

    Figure 9.  The details of one LED in strip-type structure illumination

    Figure 10.  The 3D model of ring structure illumination

    Figure 11.  The thermal model of ring structure illumination

    Figure 12.  The details of one LED in ring structure illumination

    Figure 13.  The zeroth layer lighting of the LED array ring structure illumination

    Table  1.   Thermal conductivity of LED packaging material

    Structural assemblyThermal conductivity (W·m−1·K−1)
    Chip130
    Reflector155
    Bracket and pin73
    External encapsulation0.2
    Substrate0.8
    下载: 导出CSV

    Table  2.   LED’s working parameters

    ParametersValues
    $ {h}_{a} $$10\;{\rm{W} }/({ {\rm{m} } }^{2}\cdot {\rm{K} })$
    ${T}_{{\rm{sur}}}$27 ℃
    $ P $$0.022\;8\;{\rm{W}}$
    ${P}_{{\rm{th}}}$$0.018\;24\;{\rm{W}}$
    $ V $$9.439\times {10}^{-12}\;{{\rm{m}}}^{3}$
    $ H $$1\;932\;418\;560\;{\rm{W}}/{{\rm{m}}}^{3}$
    下载: 导出CSV

    Table  3.   Surface temperatures of a single LED model in experiments

    GroupMaximum temperature (°C)Minimum temperature (°C)
    Group 140.9039.70
    Group 239.8038.50
    Group 338.5037.60
    The average39.7338.60
    下载: 导出CSV

    Table  4.   Average temperature of the LED surface with different center distances in simulations

    Center distance/mm4.04.24.44.64.85.05.25.45.65.86.0
    Average temperature/℃40.4240.0839.6539.2838.7538.4038.0337.6337.3537.2636.79
    下载: 导出CSV

    Table  5.   The measurement and analysis of LEDs surface temperatures

    GroupsLEDsMinimum temperature
    from experiments/°C
    Maximum temperature
    from experiments/°C
    Average surface temperature
    from experiments/°C
    Temperature obtained
    by fitting equation/°C
    Fitting error
    Group 1LED137.2038.5038.0538.461.08%
    LED237.1039.40
    Group 2LED336.5038.0037.4538.462.70%
    LED437.0038.30
    Group 3LED536.6038.1037.8038.461.75%
    LED637.2039.30
    下载: 导出CSV

    Table  6.   Junction temperature properties of three and four adjacent LEDs

    Center distance/mmThree LEDsFour LEDs
    Temperature obtained
    by fitting equation/°C
    Temperature from
    simulation/°C
    Fitting errorTemperature obtained
    by fitting equation/°C
    Temperature from
    simulation/°C
    Fitting error
    4.242.8844.253.10%42.8844.543.73%
    4.642.1743.222.43%42.1743.452.95%
    5.041.4742.261.87%41.4742.512.45%
    5.440.7641.491.76%40.7641.702.25%
    5.840.0640.711.60%40.0640.922.10%
    下载: 导出CSV

    Table  7.   The number of LEDs in each layer array for ring structure illumination

    The $ i $th layer arrayNumber of LEDs
    018
    122
    226
    330
    434
    下载: 导出CSV
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出版历程
  • 收稿日期:  2020-12-03
  • 修回日期:  2021-01-08
  • 网络出版日期:  2021-03-27
  • 刊出日期:  2021-05-14

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