手机嵌入式快照成像光谱仪的研制

田久谊

doi:10.37188/CO.2021-0209

手机嵌入式快照成像光谱仪的研制

doi: 10.37188/CO.2021-0209

田久谊^,

陕西快谱深光科技有限公司, 陕西西安 710065

基金项目: 陕西省重点研发计划（产业创新链项目）（No. 2021ZDLGY12-05）

详细信息

作者简介:
田久谊（1979—），女，陕西西安人，学士，工程师，2001年于西安工业大学获得学士学位，主要从事多光谱成像、光电探测器件等方面的应用光学仪器研究。E-mail：jiuyi_tian@163.com

中图分类号: O439
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出版历程
- 收稿日期: 2021-12-06
- 修回日期: 2022-01-10
- 网络出版日期: 2022-05-12

Snapshot imaging spectrometer for mobile phone

TIAN Jiu-yi^,

Shannxi Snap-spectrum Deep-light Technology Co. ltd., Xi’an 710065, China

Funds: Supported by Key R&D Plan of Shaanxi Province (Industrial Innovation Chain Project) (No. 2021ZDLGY12-05)

More Information

Corresponding author: jiuyi_tian@163.com

摘要

摘要:
目前手机摄像头已经具备在空间（x-y方向）和深度（z方向）维度上获取成像信息的能力，而在光谱维度的信息获取上一直停留在RGB三色上，受困于手机平台的尺寸限制，传统的成像光谱仪很难嵌入。本文基于多通道阵列滤光片、微透镜阵列成像和一体化集成制造技术，完成了系统整体设计、关键部件设计制造、整体装配，并实验验证了光谱成像。系统整体物理尺寸小于Φ6×6 mm，光谱分辨率为8 nm，光谱范围为0.53~0.68 μm。实验研究表明，对不同颜色的实物成像，可以获得物体任意部位的光谱曲线，验证了快照式光谱仪的设计指标。该光谱仪具备了嵌入手机的基本条件，此研究有望推动成像光谱仪在手机上集成应用。
- 成像光谱仪 /
- 滤光片阵列 /
- 微透镜阵列
Abstract:
At present, the mobile camera has the ability to obtain imaging information in the space (x-y direction) and depth (z direction) dimensions while the acquisition of spectral information has been stuck in RGB tricolor. Limited by the size of the mobile platform, the traditional imaging spectrometer is difficult to be embedded. Based on the integrated manufacturing technology of multi-channel array filters, micro-lens array imaging and integration, this paper completes the overall design of the system, the design and manufacture of the key components and overall assembly. The spectral imaging is verified experimentally. The overall physical size of the system is less than Φ6 × 6 mm, the spectral resolution is 8nm, and the spectral range is 0.53−0.68μm. The experimental results show that the spectral curves of any part of the object can be obtained by imaging the object with different colors, which verifies the design index of the snapshot spectrometer. With the basic conditions of embedding the technology into mobile phones, the system is expected to promote the integrated applications of imaging spectrometers.
- imaging spectrometer /
- filter array /
- micro-lens array

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图 1 阵列滤光片的光谱成像系统的基本结构

Figure 1. Basic structure of the spectral imaging system of an array filter

下载: 全尺寸图片幻灯片

图 2 阵列滤光片组件设计方法

Figure 2. Design method of the array filter assembly

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图 3 3×4通道滤光片理论透过率

Figure 3. Theoretical transmittance of 3×4 channel filter

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图 4 阵列滤光片的工艺路线

Figure 4. Process route of an array filter

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图 5 测试的12通道的光谱透过曲线

Figure 5. Spectral transmission test curve for the 3×4 channels

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图 6 微透镜阵列设计结果。（a）光线模拟图，单位mm；（b）3×4阵列透镜的空间位置关系；（c）模拟3×4 阵列像；（d）MTF曲线

Figure 6. Design results of the microlens array. (a) Simulation diagram of light tracing; (b) spatial position relationship of the 3×4 array lens; (c) simulated 3×4 array images; (d) MTF curves

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图 7 微透镜加工效果图。（a）表面形貌；（b）轮廓曲线

Figure 7. Processing effect of microlens. (a) Surface morphology; (b) contour curve

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图 8 （a）装配前及（b）装配后的快照式光谱相机

Figure 8. Snapshot spectral camera (a) before assembly and (b) after assembly

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图 9 实验测试结果。（a）光学布局；（b）绿色、（c）白色、（d）红色、（e）蓝色物体的光谱像

Figure 9. Experimental test results. (a) Optical layout; spectral images of a (b) blue, (c) white, (d) red and (e) blue object

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图 10 图9（b）所标点的光谱曲线（实线：微光纤光谱仪测试结果，虚线：成像光谱仪测试结果）

Figure 10. Spectral curve marked in Fig. 9 (b) (solid line: micro fiber spectrometer test results, dotted line: imaging spectrometer test results)

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表 1 CMOS的基本参数指标

Table 1. Basic parameters and indicators of CMOS

芯片型号	有效像素	图像区域	最低照度	视频制式
1/3 CMOS	760(H)×586（V）	4.8 mm×3.6 mm	0.008 Lx	PAL/NTSC

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表 2 滤光片性能对比

Table 2. Performance comparison of the filters

序号	光谱范围/nm	通道个数	半高宽/nm	平均峰值透过率/%	主要结构	参考文献
1	470~620	12	~10	~85	介质高反/二氧化硅/介质高反	[27]
2	722~880	128	1.72~3.84	~45%	介质高反/二氧化硅/介质高反	[26]
3	415~725	8	~81	~68.9	Ag高反/ 光刻胶 /Ag高反	[14]
4	400~800	5	~100	~45	Al 超表面	[28]
5	460~630	9	~27	71.2	Ag高反/ 光刻胶 /Ag高反	[14]
6	530~680	12	~8	83	介质高反/二氧化硅/介质高反	本工作

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表 3 紫外胶合剂参数

Table 3. Parameters of the UV adhesive

名称	粘度 25 °C	固化后折射率	拉伸极限	弹性模量(PSI)	抗拉强度(PSI)
NOV61	300 cps	1.56	38%	150000	3000

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表 4 胶合基本工艺和参数

Table 4. Basic gluing process and parameters

光源波长	光功率密度	预固化时间	固化时间	点胶设备
365 nm	700 mW/cm²	30 s	>10 min	尔谷光电（JZ04-365-04）

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表 5 成像光谱仪技术指标对比

Table 5. Comparison of technical indexes of the imaging spectrometer

序号	结构	光谱分辨率/nm	时间分辨率	整体尺寸/mm	光谱图像获取方式	报道时间/年	参考文献
1	芯片滤光阵列	10	和CMOS芯片同步	11.2×11.2，不带镜头	直接获取	2014	[27]
2	子孔径复合阵列滤光片	10	计算重构	原理样机平台搭建	计算重建	2019	[31]
3	子孔径复合阵列滤光片	50	计算重构	原理样机平台搭建	计算重建	2004	[32]
4	芯片滤光阵列	10	和CMOS芯片同步	实物样机约几十mm	直接获取	2019	[33]
5	傅立叶变换成像光谱仪	/	/	原理设计	计算重构	2020	[8]
6	芯片滤光阵列	计算超分后5.2 nm	计算重构	原理样机平台搭建	计算重构	2021	[22]
7	子孔径复合阵列滤光片	8	和CMOS芯片同步	功能样机Φ6×6	直接获取	2022	本工作

下载: 导出CSV

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