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摘要:
研究了一种基于微机电系统(MEMS)技术用于高压测量的硅-玻光纤法布里-珀罗(FP)压力传感器。该传感器以硅材料作为敏感元件，将电感耦合等离子体(ICP)干法刻蚀后的单晶硅膜片和高硼硅玻璃阳极键合构成FP腔。传感头使用MEMS技术批量制造，结构稳定、抗过载能力强、在高压环境下不容易失效。实验结果表明，该传感器能够实现30 MPa的高压压力测量，灵敏度为46.94 nm/MPa，线性拟合度为0.99897，测量结果具有较好的一致性和可靠性，所设计的压力传感器在高压检测方面有很强的应用前景。
Abstract:We investigate a silicon-glass fiber-optic Fabry-Perot (FP) pressure sensor based on Micro-Electro-Mechanical Systems (MEMS) technology for high-pressure measurements. Silicon material was used as the sensitive element, and the Inductively Coupled Plasma (ICP) dry-etched monocrystalline silicon diaphragm was anode bonded with a high borosilicate glass to form the FP cavity. The sensor head was manufactured in batches utilizing MEMS technology, which is structurally stable, strongly resistant to overload, and not prone to fail in high-pressure environments. The experimental results show that the sensor can acheive high-pressure measurements up to 30 MPa with a sensitivity of 46.94 nm/MPa and a linearity of 0.99897, with high consistency and reliable measurement results. The designed pressure sensor has strong application prospects in high-pressure sensing.
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Key words:
- MEMS /
- fiber-optic sensor /
- pressure measurement /
- FP interferometer
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图 2 膜片形变分布三维图
Figure 2. Three-dimensional diagram of diaphragm deformation distribution
图 3 不同膜厚条件下膜片中心形变量与有效半径关系
Figure 3. Relationship between diaphragm center deformation and effective radius at different diaphragm thicknesses
图 4 压力敏感结构模型三维受压图
Figure 4. Three-dimensional diagram of the pressure sensitive structure model under pressure
图 5 压力敏感结构模型受压形变图
Figure 5. Deformation varying with pressure for pressure-sensitive structural model
图 11 腔长与压力关系实测结果
Figure 11. Experimental results of relationship between the cavity length and pressure
表 1 传感器的参数
Table 1. Sensor parameters
Sensor Parameter Value Silicon diaphragm Effective radius 0.375 mm Thickness 0.1 mm Glass substrate Thickness 0.4 mm Sensor head Side length 2.5 mm 
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