基于光束扫描宽化技术的激光掩模微加工系统

谢冀江; 高飞; 潘其坤; 杨贵龙; 邵春雷; 张来明; 郭劲

基于光束扫描宽化技术的激光掩模微加工系统

1.
中国科学院长春光学精密机械与物理研究所激光与物质相互作用国家重点实验室,吉林长春130033;
2.
中国科学院研究生院,北京100039

基金项目:

中科院知识创新工程资助项目

详细信息

作者简介:
谢冀江(1959-),男,江苏镇江人,研究员,主要从事激光器及激光应用技术方面的研究。 E-mail:laserxjj@163.com 高飞(1988-),男,山西朔州人,硕士研究生,主要从事激光器及激光应用技术方面的研究。 E-mail:gaofei0104@163.com 潘其坤(1985-),男,河南开封人,硕士研究生,主要从事激光器及激光应用技术方面的研究。 E-mail:panqikun2005@163.com

谢冀江(1959-),男,江苏镇江人,研究员,主要从事激光器及激光应用技术方面的研究。 E-mail:laserxjj@163.com 高飞(1988-),男,山西朔州人,硕士研究生,主要从事激光器及激光应用技术方面的研究。 E-mail:gaofei0104@163.com 潘其坤(1985-),男,河南开封人,硕士研究生,主要从事激光器及激光应用技术方面的研究。 E-mail:panqikun2005@163.com

中图分类号: TN305.7
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出版历程
- 收稿日期: 2011-10-15
- 修回日期: 2011-12-13
- 刊出日期: 2011-12-25

Laser mask micromachining system based on beam-scanning widening technique

1.
State Key Laboratory of Laser Interaction with Matter, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China;
2.
Graduate University of Chinese Academy of Sciences, Beijing 100039, China

摘要

摘要: 利用Nd∶KGW激光器,采用光束扫描宽化技术和掩模微缩成像方法研制了用于微打标及微型零件雕刻成形的激光掩模微加工系统。系统采用计算机打印的塑料胶片或液晶作掩模,光束扫描面积为(有效掩模面积)30 mm30 mm。微缩成像系统的缩小倍率分别为8~10倍(f=100 mm透镜)和15~20倍(f=50 mm透镜)。对该系统的加工尺寸和加工精度进行了分析。实验结果表明:系统达到的最小标刻宽度和加工图形精度均为10 m,与分析结果一致。系统的单次加工深度为0.07~0.1 m,最大加工深度为200 m,可满足工业微加工技术的基本要求。
- Nd∶KGW激光器 /
- 微加工 /
- 掩模
Abstract: Based on a Nd∶KGW laser, a beam-scanning widening technique and a mask micro-imaging method, a laser mask micromachining system is developed to applied to the micro-marking, carving and forming of miniature workpieces. The plastic film printed by a computer or the liquid crystal are used as masks in the system, and the beam-scanning area(effective mask area) is determined as 30 mm30 mm. The focal lengths of micro-imaging system are selected as 100 mm and 50 mm, which scale down 8~10 and 15~20 times, respectively. The processing size and precision of the system are analyzed, and results indicate that both the minimum marking width and graphic precision of the micromachining system are 10 m, which is consistent with the analysis results. The processing depth of a single laser pulse is 0.07~0.1 m, and the maximum processing depth is 200 m. The micromachining system satisfies the basic requirements of industrial micromachining technology.
- Nd:KGW laser /
- micromachining /
- mask

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