激光清洗技术在芯片封装模具中的应用

杨金芳; 何涛涛; 安浦瑞; 杨沛年; 袁诗超; 毕超; 田新叶; 汪满; 张进兵; 李泽靖; 令维军

doi:10.37188/CO.2025-0122

Article Contents

Chinese Optics > 2025 > Accepted Manuscript

YANG Jin-fang, HE Tao-tao, AN Pu-rui, YANG Pei-nian, YUAN Shi-chao, BI Chao, TIAN Xin-ye, WANG Man, ZHANG Jin-bing, LI Ze-jing, LING Wei-jun. Application of laser cleaning technology in chip packaging molds[J]. Chinese Optics. doi: 10.37188/CO.2025-0122

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Application of laser cleaning technology in chip packaging molds

doi: 10.37188/CO.2025-0122

cstr: 32171.14.CO.2025-0122

YANG Jin-fang^{1, 2, 3, 4
,},
HE Tao-tao^{1, 3},
AN Pu-rui^{1, 3},
YANG Pei-nian^{1, 3},
YUAN Shi-chao^{1, 3},
BI Chao^{1, 3},
TIAN Xin-ye^{1, 3},
WANG Man^{1, 3},
ZHANG Jin-bing^{2, 5},
LI Ze-jing^{2, 5},
LING Wei-jun^{1, 2, 3, 4
,
,}

1.
Gansu All-Solid State Laser Engineering Research Center, Tianshui 741001, China
2.
Integrated Circuit Engineering Research Center of the Ministry of Education, Tianshui 741001, China
3.
School of Electronic Information and Electrical Engineering, Tianshui Normal University, Tianshui 741001, China
4.
Gansu Integrated Circuit Packaging and Testing Industry Research Institute, Tianshui 741001, China
5.
Tianshui Huatian Technology Co., Ltd., Tianshui 741001, China

Funds: Supported by National Natural Science Foundation of China (No. 62405221, No. 62165012); Gansu Province University Industry Support Plan Project (No. 2024CYZC-44); Key Talent Project of Gansu Province (No. 2025RCXM023); Major Cultivation Project of University Research and Innovation Platform of Gansu Provincial Department of Education (No. 2024CXPT-12); Tianshui Strong Science and Technology Award Special Project (No. TS-STK-2024A-277); Qinzhou District Science and Technology Plan Project (No. 2024-SHFZG-8159); Basic Research Program of Gansu Provincial Science and Technology Plan (No. 25JRRE009, No. 25JRZE003, No. 25JRRE003); Gansu Province University Postgraduate Innovation Star Project of Tianshui Normal University (No. 2025CXZX-985); Postgraduate Research Innovation Guiding Project of Tianshui Normal University (No. TYCX2441)

More Information

Corresponding author: wjlingts@sina.com
Received Date: 18 Sep 2025
Accepted Date: 13 Nov 2025

Available Online: 03 Dec 2025

Abstract

Abstract

Laser cleaning technology, as an efficient and environmentally friendly surface treatment method, plays significant application potential in the field of chip packaging molds cleaning. This research systematically investigated the influence of laser parameters (pulse duration, repetition frequency and average power) on the cleaning effect of chromium-plated mold surface epoxy encapsulation materials (EMC) contaminated by P20 alloy and ASP23 alloy. The experiment employed a 1064 nm neodymium-doped pulsed laser, reshaping the Gaussian beam into a flat-top beam, and combining with a "bow" shape scanning path of the galvanometer mirror. The process parameters were optimized using a single-variable method. The experimental results indicated that when the laser energy density was between 0.55 and 0.77 J/cm², the pulse duration and repetition rate needed to be adjusted in coordination to balance the thermal input, enabling complete removal of contaminants without any damage to the substrate. Parameter sensitivity analysis revealed that the optimal duty cycle range was from 0.8% to 1.0%. Furthermore, when the power exceeded the threshold (150 ns@50% average power or 200 ns@50% average power), it may cause damage to the substrate, which indicated that laser parameter matching was crucial for the cleaning effect and material protection. This research provided a high-precision, non-contact and environmentally friendly cleaning solution for chip packaging molds, and verified the feasibility of laser cleaning technology in the field of integrated circuits.
- laser cleaning technology,
- chip packaging mold,
- duty cycle,
- surface treatment

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References(36)

References

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Application of laser cleaning technology in chip packaging molds

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