Design of hyperspectral imager equivalent focal plane assembling module
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摘要: 高光谱成像仪CCD组件在装调时，纵向需要满足20 m焦深要求，横向需要实现光谱维、空间维的对准。为了避免检测时对昂贵的CCD频繁安装、拆除，设计了一种等效焦面装调模组。等效模组按照CCD组件的实测尺寸精密制造，提供了可供显微镜观察的模拟光谱像。通过测量实际光谱像和模拟光谱像的位置差别能够获取修磨垫的修整量，并实现光谱像和CCD像元的横向对准。试验表明，存在工具显微镜测量误差、修磨垫加工误差、互换性误差时，光谱像面各处离焦量均小于焦深。试验中仅用3次迭代即达到MTF为0.3的要求，提高了装调效率和操作安全性。Abstract: When assembling CCD of hyperspectral imager, 20 m focal depth should be satisfied in longitudinal direction, and alignment in spectral and spacial direction should also be achieved. An equivalent focal plane assembling module is designed to avoid frequent installation of expensive CCD during measurements. The equivalent module is precisely manufactured according to measured dimensions of CCD module. It also provides simulated spectral image that could be observed by microscope. By measuring distance between real and simulated spectral image, spacer's reshape value is calculated, and spectral image is aligned to CCD laterally. Experiment shows that the whole spectral image's defocusing value is in focal depth in the presence of tool microscope measuring error, spacer reparation error and interchangeability error. MTF is higher than 0.3 after 3 iterations in experiment, which shows an improvement on efficiency and safety.
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